Hwang-Sun is a professional manufacturer at hot melt machine field. It has 20 years experience on hot melt machine, and combines with professional electronic hot melt to develop the low pressure electronic package machine, HS6200-U. It could help electronic components to protect high temperature, water, dust, chemical corruption, and compact. Currently, switches, sensors, car-components, and electronic components are packaged by plastic injection or multi-liquid adhesive material. It has several disadvantages that cannot to solve, but the low pressure electronic package machine does not have these problem, and its advantages are list below.

1.Spray glue in spot-and strip-shape.
2.Buckle-cup design for tank switch,open handle,easy operation,and free of air-burst risk
3.Scrape glue 2-10MM wide instead of double-sided glue tape.
4.Apply to middle-processing instead of nail.
5.This machine can select pot-and strip-spray and glue-scraping nozzles.
6.Apply to shoes-making and electronics.

1.Spray glue in spot-and strip-shape.
2.Apply to middle-processing instead of nail.
3.The nozzles for HS0752B-2 can scrape glue 2-10MM wide instead of double-sided glue tape.
4.Buckle-cup design for tank switch,open handle easy operation, and free of air-burst risk.
5.Apply to shoes-making and electronics.